The Galaxy Flip 8 Could Be the Last of Samsung's Clamshell Foldables
Samsung's Galaxy Z Flip 8 may be the last clamshell foldable in the series, according to a tipster who claims there's no Flip 9 on the brand's roadmap. …
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TSMC Says it Will Move to Nanosheet Transistors at 2nm
… That won't be for a few more years and Intel and Samsung have announced similar plans. News of TSMC's updated roadmap comes in a report from EEtimes Opens in a new window , which discusses the company's future plans. …
TSMC still struggling with 28nm, Qualcomm and Nvidia threaten to jump ship
… It's too early to say, but Intel's roadmap says it will be at 10nm by 2015 -- two full process nodes ahead of TSMC, GloFo, and Samsung. With 32nm Medfield on the market, 22nm Merrifield Silvermont due next year, and 14nm Airmont chips in 2014, ARM Holdings and its partners must be a little nervous. …
How Intel Lost $10 Billion and the Mobile Market
… Of Fabs and Foundries The semiconductor industry is dominated by four companies: GlobalFoundries, Intel, Samsung, and TSMC. Three of these companies -- GlobalFoundries, Samsung, and TSMC -- are known as pure-play foundries or merchant foundries. …
TSMC Mulls 3nm Foundry, Additional Investment at Future Arizona Fab
… We don't know when AMD will launch 5nm CPUs, but most roadmaps have suggested we won't see volume on consumer chips until Q1-Q2 2022. …
Intel delays Broadwell release date until 2014 because of defect density issues
… GlobalFoundries, Samsung, and IBM are pushing ahead with plans for a hybrid 14-20nm process, in which chips would marry 14nm front-end manufacturing with 20nm interconnects. The result if it works , would be a chip with 14nm-style power consumption and performance, but 20nm size. …
This is what the death of Moore's law looks like: EUV rollout slowed, 450mm wafers halted, and an uncertain path beyond 14nm
… 450mm wafers and EUV 18 months ago, TSMC, Intel, and Samsung made headlines when they all poured money into ASML's efforts to develop 450mm wafers. …
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