Intel angles for HBM crown – Fudzilla.com
… Z-Angle Memory, or ZAM, is being cooked up with SoftBank and is meant to be a low-power, high-density alternative to HBM for serious bandwidth and capacity. …
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Nvidia to push Vera CPUs at Computex – Fudzilla.com
… The analysts expect Nvidia to claim Vera delivers 1.5 times faster performance, two times overall performance and four times higher density per rack than rival x86 chips from Intel and AMD. …
Huawei reckons folding chips beats sanctions – Fudzilla.com
… Huawei expects to design high-end chips by 2031 with transistor density matching products made on a 1.4-nanometre process. …
Rambus tries to unbung AI data pipes – Fudzilla.com
… The Rambus PCIe 7.0 Switch IP with TDM is meant to reinforce the company’s high-speed interface IP push. …