… CXMT has been working hard on DDR5 DRAM and is trying to close the gap with the three DRAM giants. The company is already offering speeds of up to 8000 MT/s, with DRAM dies in 16Gb and 24Gb capacities. …
… Demand for AI computing kit has tightened supplies of HBM, DRAM and other chips because they rely on many of the same raw materials. Samsung is said to be looking at gate-all-around FET, or GAAFET, fabrication technology for its next-generation DRAM chips. …
… TOPICS: 3D stacked DRAM · advanced packaging · AI memory bandwidth · hbm4 · hbm4e · Intel · VLSI Symposium 2026 · Z-Angle Memory · ZAM Latest articles News May 4, 2026 Intel names Alex Katouzian as Lead Client Computing and Physical AI Group and Pushkar Ranade as CTO News May 4, 2026 xAI’s GPU moun… …