…especially in segments where large unified memory capacities and integrated AI acceleration are becoming important differentiators for professional workflows and on-device AI processing. Source: AMD Share this content Twitter Facebook Reddit…
…The new category places Gemini AI at the center of the device experience and appears to define a more structured hardware baseline for upcoming systems. Intel has confirmed that it has collaborated…
…AMD EXPO DDR5 memory compatibility, USB Type-C connectivity, and integrated quick-release mechanisms for graphics cards and M.2 storage devices. The iGame B850M ULTRA-S is positioned as the mainstream…
…The USB-CVDK22 integrates a total of 10 ports into a compact chassis measuring 120 mm wide, 56 mm deep, and 17 mm high. Despite the small footprint, the docking station includes…
…The drives are offered in both M.2 2242 and M.2 2280 form factors, allowing integration into compact edge devices, industrial PCs, fanless systems, and sealed hardware platforms. Unlike many mainstream…
…Bose integrates TrueSpatial processing to enhance stereo and non-Atmos content, while CustomTune calibration adjusts audio output based on room acoustics using a mobile device microphone. The updated Bose application simplifies setup…
Microsoft has announced a new wave of Surface devices aimed first at business customers, including the Surface Pro 12 for Business and Surface Laptop 8 for Business in 13-inch, 13.8…
…Modern compute platforms are placing increasing pressure on interconnect bandwidth as GPUs, CPUs, storage devices, and networking hardware exchange larger datasets at higher speeds. AI training and inference workloads in particular are…
…Titan Lake is also rumored to feature a collaboration with NVIDIA through the integration of an RTX GPU tile directly into the processor package. If accurate, the platform would compete more directly…
ARCTIC has announced the TP-4 thermal pad series, a new thermal interface material designed for use across graphics cards, laptops, gaming consoles, RAM modules, chipsets, and integrated circuits. The new pads…