Broadcom Helps CPU And XPU Makers Go Vertical With Compute
…We have gone vertical with DRAM memory with HBM stacks, which is relatively simple given the low power draw of memory chips compared to the ASICs that shuttle data around and compute…
Tracked topic
DRAM, or dynamic random-access memory, is a volatile computer memory technology that stores bits in capacitors and requires periodic refreshing to maintain data.
…We have gone vertical with DRAM memory with HBM stacks, which is relatively simple given the low power draw of memory chips compared to the ASICs that shuttle data around and compute…
…In CUDA, another optimization is kernel fusion, where Nvidia is “able to take several kernels and bring them together to make one slightly larger kernel, which can dramatically speed up all the…
…We would like for the WS-4 to have optical links coming out of the wafer to shared DRAM memory trays to significantly expand the MemoryX capacity of the CS-4 system…
…It is important to remember that some of this growth is for price changes as the costs of GPU accelerators, CPUs, DRAM memory, and flash storage have gone bonkers in recent months…
…The change is dramatic. Let’s say that you want to have a row of compute and networking based on Ethernet that links 512 XPUs together and that you want to use…
…An eight-way MI355X node with shared GPU memory of 2.3 TB of HBM3E stacked DRAM memory and 64 TB/sec of aggregate bandwidth, coupled by 896 GB/sec of Infinity…
…Hence, the dramatic $20 billion acquihire of Groq, which could not be an outright acquisition because that might take a year or two and might not pass muster with the world’s…
…package the compute engine and networking chips, only three suppliers of HBM and high-end DRAM, and the capacity for main memory and flash memory and advanced packaging is pretty tight. Given…
…Amy Hood, Microsoft’s chief financial officer, said that Microsoft raised its calendar 2026 capex spending plan to $190 billion, and just to show us how bad the price increases on DRAM…
…GPUs with fast HBM hold relevant parts of the embedding tables that are “hot” and the rest are dumped off to CPUs with fat DRAM hold the rest. I went through this…