…The announcement addresses one of the most significant challenges facing advanced semiconductor and system design: accurately modeling the interaction of electrical, thermal, mechanical, optical, and electromagnetic effects across increasingly complex products. As…
…The announcement underscores the growing importance of electronic design automation (EDA), design technology co-optimization (DTCO), and multi-die methodologies as semiconductor companies push toward increasingly complex AI, HPC, automotive, and data…
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is…
…Leading-edge silicon demand remains supply constrained, particularly for advanced GPUs, AI accelerators, networking ASICs, and high-bandwidth memory integration. TSMC remains the dominant manufacturing partner for virtually all major AI chip…
…Under the new agreement, Chips&Media will provide its AV2 hardware encoder and decoder IP cores for integration into custom system-on-chip (SoC) platforms targeting data centers, AI infrastructure, edge computing…
…Announced October 8, 2021 , terms not disclosed.) OPEN-SILICON INC Zenasis Technology IP assets (Zenasis folds) OPENEDGES Technology, Inc. (IP for memory system, AI platform) The Six Semiconductor (Memory PHY, acquired 2019…
…The era of manual, schedule-volatile characterization is ending, replaced by generative and agentic AI workflows. At the heart of the suite is the new Solido Characterizer . For foundries and design teams…
We live in an exploding AI world, and this has put pressure on foundries to deliver new products faster than ever before. Any help to accelerate the semiconductor R&D goes a…
…His presentation titled “Accelerating AI Chip Development with 3D Multi-Die Designs” closed with a Synopsys prediction of 50% of new chip designs in the HPC market being multi-die by the…
