…The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance computing (HPC…
…This includes design enablement, IP integration, packaging qualification, substrate technologies, and manufacturing interoperability. For fabless semiconductor companies, especially startups and European innovators, this reduces development risk and accelerates the path from prototype…
…Instead of building one massive processor, designers partition functionality into multiple smaller dies optimized for different tasks and manufacturing nodes. Compute chiplets may use advanced 3nm or future 2nm technologies, while I…
…For semiconductor companies developing next-generation server processors and AI accelerators, the combination of Akeana’s infrastructure IP and Samsung’s manufacturing ecosystem could provide a faster path to production silicon. In…
…Modern AI applications frequently move large quantities of data between processors, neural processing units (NPUs), graphics processors and system memory. Bottlenecks in memory throughput can limit the effectiveness of advanced AI accelerators…
…18A generation and future nodes such as Intel 14A, making it one of the most significant process enhancements in Intel’s recent manufacturing road map. See More About Intel Process Innovation Also…
SPI, invented some four decades ago, is so successful as a low-pin-count interface for microcontrollers and processor cores that it spurred memory makers to incorporate both the physical signaling interface…
…than focusing solely on manufacturing. Security and data governance are additional factors driving the importance of this initiative. AI systems increasingly process sensitive government, industrial, healthcare, and defense-related data. European policymakers…
…By securing early enablement and certification, Siemens ensures that mutual customers can begin development with confidence on TSMC’s newest manufacturing platforms. Another important focus at the forum was advanced packaging and…
…twenty years and billions of dollars to become real. TSMC’s process discipline gave ASML a proving ground. ASML’s roadmap gave TSMC the node leadership no integrated device manufacturer could match…