…Certified digital and analog flows, integrated with Synopsys.ai , are now available for TSMC’s N2P and A16 processes, incorporating the innovative NanoFlex architecture . This setup not only boosts performance but also…
The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the…
…Multiphysics and AI-Driven Design Innovations Synopsys and TSMC are advancing multiphysics analysis for complex, hierarchical 3DIC designs. The multiphysics flow integrates tools like Ansys RedHawk-SC ™, Ansys RedHawk-SC Electrothermal ™, and…
…The WAVE-N specialized video processing NPU, developed by Chips&Media , represents a modern approach to integrating AI acceleration with video processing pipelines for next-generation edge devices. At the core of…
…AI’s Insatiable Demand for Custom Compute A central theme of the presentation is that artificial intelligence (AI) is not just another workload but a forcing function reshaping silicon design. AI workloads…
…integration, efficiency, and performance in next-generation designs. Also Read: From Satellites to 5G: Ceva’s PentaG-NTN™ Lowers Barriers for Terminal Innovators Ceva IP: Powering the Era of Physical AI Ceva…
…These design options allow PCIe 5.0 to meet the highly variable requirements of modern AI and computing workloads. Integration Considerations for Edge SoCs Incorporating PCIe 5.0 into edge SoCs requires…
…Domain-specific accelerators, near-memory compute, and chiplet-based 3D integration all play a role, but Godwin emphasized that the real breakthrough comes when AI-driven electronic design automation (EDA) is applied…
…From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past Two Paths for AI in Semiconductor Manufacturing: Platform Integration vs. Point Solutions WEBINAR: Beyond Moore’s Law and…
…Heterogeneous Integration by Mike Gianfagna on 05-29-2025 at 10:00 am View Forum Posts View Articles Private Message Categories: 3D IC , IP , Synopsys The trend is clear, AI and HPC…