Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC by Daniel Nenni on 05-20-2026 at 10:00 am View Forum Posts View Articles Private Message Categories: 3D IC , Chiplet , EDA , Events , Foundries , Siemens EDA , TSMC Key takeaways ▼ At the recent TSMC Technology Symposium 2026 , S… …
… Over time, driven by the unstoppable rise of software-defined systems and the unprecedented demands of AI-era computing, HAV has outgrown its original purpose. Verification teams will continue to push the envelope across all software-driven use cases. …
… AI demand is driving unprecedented silicon and memory intensity per system, not just more units but fundamentally heavier systems. …
… Right now, we are focused on expanding our software ecosystem to support additional programming models and frameworks, making integration even easier. We’re also optimizing performance and efficiency for emerging workload patterns as HPC and AI workflows converge. The roadmap is driven by feedback. …