… Alchip’s 2nm platform demonstrates how future AI processors will increasingly rely on heterogeneous integration. The platform supports combining 2nm compute dies with 3nm or 5nm I/O chiplets using multiple forms of advanced packaging, including CoWoS-L and SoIC stacking. …
… Advanced Packaging and 3D Integration As AI workloads continue to scale, advanced packaging technologies are becoming as critical as process nodes themselves. …
… Held July 26–29, 2026, at the Long Beach Convention Center in California, DAC continues its evolution from a traditional Electronic Design Automation EDA conference into a broader “Chips to Systems” platform that connects silicon, software, packaging, AI infrastructure, and system architecture. …
… By securing early enablement and certification, Siemens ensures that mutual customers can begin development with confidence on TSMC’s newest manufacturing platforms. Another important focus at the forum was advanced packaging and 3D integration. …
… Beyond individual dies, the partnership continues to push into advanced packaging and system-level integration. …
… Through deeper co-optimization across design, packaging, test, and manufacturing, Synopsys and Samsung Foundry are providing customers with a comprehensive platform for developing the AI and multi-die architectures that will power future computing infrastructure. …
… Consequently, advanced packaging and system integration technologies have become central to performance scaling. …
… AI Becomes an Engineering Platform Artificial intelligence was the dominant theme of the conference, particularly during the keynote by Da Yang of NVIDIA. …
… Advanced packaging and multi-die design break reticle limits, but introduce issues like signal integrity and system pathfinding. …
… As organizations increasingly deploy AI assistants and knowledge management platforms, protecting proprietary semiconductor data becomes even more important. …