Synopsys and Samsung Foundry Extend AI-Driven Design Collaboration for Advanced 2nm and Multi-Die Systems by Daniel Nenni on 06-08-2026 at 10:00 am View Forum Posts View Articles Private Message Categories: EDA , Samsung Foundry , Synopsys Key takeaways ▼ At SAFE Forum 2026 , Synopsys announced sig… …
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling by Daniel Nenni on 05-19-2026 at 6:00 am View Forum Posts View Articles Private Message Categories: 3D IC , Chiplet , Foundries , TSMC Key takeaways ▼ imec announced that IC-Link by imec has joined the TSMC 3D… …
… The company is investing heavily in manufacturing expansion, advanced packaging, and foundry services while attempting to compete aggressively in AI and high-performance computing. …
… The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into trade secret management. …
Is Intel About to Take Flight? by Jonah McLeod on 04-21-2026 at 10:00 am View Forum Posts View Articles Private Message Categories: Foundries , Intel Foundry Key takeaways ▼ The Pan Am–Boeing playbook and what Musk’s Terafab order could mean for Intel Foundry “We either build the Terafab or we don’… …
… The company’s N2 ramp, advanced packaging expansion, overseas fab deployment, and ongoing EUV intensity growth all point toward sustained elevated investment levels. …
… The announcement also highlights expansion into new application domains. …
… This expansion allows for massive increases in memory bandwidth and compute capability. …
… Also Read: ASML High-NA EUV is Not Ready for High-Volume Production Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling Share this post via:
… As a result, inference is rapidly becoming the dominant driver of compute infrastructure expansion. …