… For engineers, architects, and product leaders working in wireless audio, connectivity, or system-on-chip SoC design, this session provides both practical insights and a forward-looking perspective on integration trends shaping the industry. …
… Imec already possesses deep expertise in heterogeneous integration, silicon photonics, advanced packaging, and ASIC development. Through IC-Link, these research capabilities can now be directly connected to TSMC’s production ecosystem. …
… As a result, AI-enabled EDA tools are becoming critical to reducing development cycles and improving productivity. Siemens emphasized that its AI technologies are being integrated directly into production-proven tools such as Calibre and Aprisa. …
… The base N2 node entered production in 2025, followed by N2P in 2026 as an enhanced version. …
… Nasdaq: SNPS is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. …
… And that’s how Synopsys addresses the test barrier for heterogeneous integration. …
… Beyond individual dies, the partnership continues to push into advanced packaging and system-level integration. …
… NVIDIA’s adoption of HAPS-200 prototypes achieved 50 MHz speeds, boosting software productivity in compressed cycles. …
… Support SoC customers to ensure seamless integration and high-quality CPU blocks. …
… Additionally, wafer-scale integration technologies such as System-on-Wafer SoW extend this concept further, enabling integration at scales exceeding 40 reticles, equivalent to 64 HBM stacks. …