…The supplier concentration finding is particularly actionable. In one Surface Laptop 7 configuration, three suppliers account for approximately 73% of packaged-IC carbon. In a Zenbook S14 model, three suppliers account for…
… Five companies supply those machines and collectively control the world supply of leading-edge chip production. …
… These realities must be considered alongside the modulation choice, packaging strategy, and thermal constraints. …
… Why This Is Not Just 3D Packaging The Vertical System EM Corridor is related to 2.5D and 3D integration, but it is not the same concept. 2.5D and 3D packaging describe physical placement and interconnect methods. …
… Golden timing constraints. …
… There’s also growing concern around supply chain constraints in advanced packaging. …
… Teams that want to bring real constraints to a technical discussion are exactly the conversations we are looking for. …
… This creates enormous pressure on manufacturability, semiconductor scalability, packaging, calibration infrastructure, yield optimization, power consumption, and supply chain resilience. …