… These domains can no longer be optimized independently. Gains in logic efficiency stall without sufficient memory bandwidth. Advances in memory bandwidth fall short if packaging cannot deliver proximity within thermal and mechanical constraints. …
… In “ The History, Status, and Future of FPGAs ,” published in Communications of the ACM , engineers at Xilinx and organizations such as Bell Labs , Fairchild Semiconductor , IBM , and Sun Microsystems said the earliest uses of FPGAs were for prototyping ASICs . …
… Now scientists have created monolithic 3D chips from silicon at less than 200 ℃. “For years, people assumed monolithic 3D would require exotic new materials such as carbon nanotubes , metal-oxide semiconductors , or 2D semiconductors, “ says Qing Cao , an associate professor of materials science an… …
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… Initiatives like Taiwan Semiconductor Manufacturing Co. ’s University FinFET Program and new government-funded chip-design hubs now let some well-resourced universities design for more advanced architectures, but the technology is still out of reach for many academics. …