… Global Manufacturing Raises the Value of a Common Platform Samsung’s expansion across advanced memory, logic, and packaging increases the need for tighter alignment between design environments, production systems, and analytics platforms. …
… AMD and TSMC continue to collaborate on process and packaging technologies. In addition to the 2nm node, AMD is leveraging advanced packaging technologies, including SoIC-X and CoWoS-L, across its broader data center and AI portfolio. …
… Two-Phase Cooling Targets Next-Gen Power Levels ZutaCore’s platform focuses on waterless two-phase direct-to-chip cooling, designed to support processors exceeding 4,000W. …
… Automation Platform Dell’s management story centers on the Dell Automation Platform, which becomes the common control layer for private cloud deployments and future AI-driven operations. …
… Storage units are not exclusively a Dell construct in this platform. …
… Retail Edge AI AMD also pointed to retail edge AI as a fit for the platform. …
… IBM and Red Hat are extending their established enterprise open-source model beyond curated platform components to include independent libraries, language toolchains, AI frameworks, and data streaming platforms. …
… Even the packaging reflects this commitment. Corrugated materials contain up to 93% recycled content, and plastic packaging incorporates at least 30% recycled content. …
… Cross-platform support, Toolkit for backup and mirroring, and two years of Rescue Data Recovery Services round out a package that covers the basics without asking for much from the user. …
… Components are sourced through audited channels, firmware is signed, and platforms ship with tamper-evident packaging and seals that the receiving team can verify against shipment manifests. …