…Vess A8340 A fully integrated AI and intelligent surveillance platform powered by multi-GPU architecture and Intel Xeon 6 processors. With six PCIe Gen 5 x16 slots, it combines storage, compute, and…
…TSMC 4 nm FinFET GPU Integrated AMD Radeon 890M Graphics (RDNA 3.5 Architecture) 16 Compute Units Up to 3.1 GHz NPU Integrated AMD Ryzen AI Engine (XDNA2 architecture) Up to…
…It integrates hardware‑level protections, platform security and standardized configurations that help maintain control. This includes secure biometric authentication with a built-in fingerprint sensor and IR camera, enabling fast, password-free…
…The keyboard has an 8,000 Hz polling rate and an integrated 3.1-inch full-color OLED touchscreen. This can display system information, gameplay analytics and quick access to settings and…
…Every ME Pro features 10GbE + 2.5GbE dual Ethernet ports, enabling rapid synchronization of large assets as well as bandwidth aggregation, link separation, and advanced networking features. Storage scalability is another highlight…
…In addition, Sony believes that integrating its hardware, software, including AI, entertainment content and network services and minimizing their energy consumption, as well as investing in R&D to effect such integration…
…For starters, Intel doesn't believe that the Arc G3 is a "processor with integrated graphics," but rather a "GPU with an integrated CPU." Such a philosophy was needed to serve as…
…Through this demonstration, ECS will further present the flexibility and practical value of integrating AI Agent applications into commercial PC environments. Extending Edge AI into Healthcare and Private Knowledge Applications ECS will…
…With its compact form factor and thoughtfully integrated features, ExpertCenter P200 AiO is engineered to support the needs of offices, front desks and shared workspaces—enabling users to work efficiently, stay connected…
…These efforts build on AMD's deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI…