… SK hynix is interested in integrating this technology into its HBM memory, presumably to bring its HBM4 memory modules up to standard for EMIB integration, should its AI chip partners choose Intel Foundry for advanced packaging of their next-generation solutions. …
… These impressive figures could quickly overshadow competing HBM4 memory, as HB3DM offers much higher bandwidth. HBM4 provides speeds of around 2 TB/s per stack, less than half of what HB3DM will deliver. …
… SK hynix's Wafer Level Packaging WLP process, based on its market-proven Mass Reflow Molded Underfill MR-MUF technology, enables stable high-volume production of iHBM-equipped chips. …
… On HBM specifically, Samsung said it began mass-production sales of HBM4 for NVIDIA's Vera Rubin platform in February and is on track to more than triple HBM revenue this year versus last. …
… The targeted production lines in the strike are for HBM, LP DDR5, and some custom logic production. …
… B70: 32 Xe2 cores 4,096 FP32 , 32 GB GDDR6, 256-bit bus, B65: 20 Xe2 cores 2,560 FP32 , 32 GB GDDR6 Possibly 300 W TDP Arc Pro B70 launched March 25 at $949.99, retail April 24 Consumer Arc B770 gaming GPU status unclear with Xe3P skipping gaming NVIDIA Vera Rubin updated Release Date: 2026 Six mon… …