Tracked topic
Monday, May 11th 2026 SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory by AleksandarK May 11th, 2026 10:35 Discuss 0 Comments SK hynix is collaborating with Intel to utilize its Embedded Multi-die Interconnect Bridge EMIB 2.5D packaging technology for HBM memory. …
… According to SK Group chairman Chey Tae-won, who also oversees SK hynix, if companies like SK hynix do not increase their memory supply, customers will find ways to use less memory by optimizing their infrastructure and software for much lower utilization. …
… According to South Korean media outlet The Elec, major memory makers such as SK hynix, Samsung, and Micron have reportedly begun designing DDR6 in their labs and are gradually coordinating module development with substrate manufacturers. …
… Interestingly, with further support from SK hynix, Samsung, Micron, and now CXMT, LPCAMM2 is aiming to become a universal standard for memory. …
… As demand for GPU memory remains high, NVIDIA can balance the supply of 16 Gb GDDR7 modules by utilizing a new batch of 24 Gb GDDR7 modules from partners like SK hynix, Samsung, and Micron. …
… The two major Korean suppliers may have adopted different pricing strategies: Samsung Electronics is pursuing a more aggressive one-step pricing approach with sharper increases, while preliminary quotations from SK hynix indicate relatively milder hikes through a gradual price-raising strategy, wit… …
… If Samsung's customers perceive uncertainty from the production capacity stall, many could shift to competitors like SK hynix or Micron. …
… This "Gorgon Halo" test system shows 188 GB of usable memory, likely using the 192 GB distributed across eight SK hynix 24 GB LPDDR5X modules. …
… South Korean memory makers such as SK hynix and Samsung usually reveal which iteration of their 10 nm manufacturing technology is used for chip manufacturing, but that is not the case here. …
… The latest V-Color OC RDIMM lineup for Intel W890 platforms is built with the new SK hynix 8000 MT/s DDR5 Chips. …