Wednesday, May 27th 2026 Rambus Enables Next-Generation AI PC Memory with Complete Client Chipset for CUDIMM and CSODIMM Modules Press Release by TheLostSwede Today, 10:01 Discuss 3 Comments Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced its comple… …
Monday, May 18th 2026 TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone Press Release by TheLostSwede Monday, 10:36 Discuss 6 Comments TetraMem Inc., a Silicon Valley-based semiconductor company developing analog in-memory computing IMC solutions, today announced the… …
… These efforts build on AMD's deep ecosystem partnerships and long-standing leadership in chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding and rack-scale system design for next-generation AI infrastructure. …