SK Hynix is embedding cooling into HBM memory to stop AI chips from overheating
SK Hynix has introduced iHBM, a high-bandwidth memory packaging solution that changes how and where heat is managed inside the package. …
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DDR6 development begins as Samsung, SK Hynix, and Micron target 2028-2029 launch
According to Korean publication The Elec, Samsung, SK Hynix, and Micron have asked substrate manufacturers to move forward with DDR6 production. …
Fake DDR5 sticks with dummy plastic chips are the latest RAM scam
… The photos show a 16GB DDR5 SO-DIMM module carrying a Samsung label, despite the components on the PCB being clearly marked as SK Hynix parts.Read Entire Article