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Showing top 57 results for "manufacturing & process"

tomshardware.com › tech-industry › semiconductors

Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's Law

…It allows the company to develop high-performance smartphones and AI processors without relying on restricted Western manufacturing equipment like extreme ultraviolet (EUV) lithography machines. Delivering a keynote address at the symposium…

May 25, 2026 · Etiido Uko

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tomshardware.com › tech-industry › semiconductors

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

…SK hynix says the technology can be manufactured at scale using its existing Wafer Level Packaging (WLP) process, which is built on its Mass Reflow Molded Underfill (MR-MUF) packaging technology already…

May 26, 2026 · Etiido Uko
tomshardware.com › pc-components › cpus

AMD silently removes memory encryption from consumer Ryzen CPUs, leaving users unaware that they may be vulnerable — security feature vanishes after newer AGESA firmware, AMD engineers go radio silent when pressed about the change

…However, without prior notice, AMD appears to have scrapped the security feature in these processors. According to the Ars report, the company's only official reaction to the matter — not counting the…

Jun 17, 2026 · Etiido Uko