SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers
… The company believes that structurally preventing thermal throttling will enable next-generation memory layers targeted for future generations like HBM5 to scale to higher stack heights and sustain maximum data transfer speeds under the heavy computational loads of AI data centers. “iHBM is the opt… …