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tomshardware.com › tech-industry › semiconductors

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

Share prices of both Intel and SK hynix have surged following a ZDNet Korea report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge EMIB technology, with the intention of integrating high-bandwidth memory HBM and logic semiconducto… …

May 11, 2026 · Luke James