Semiconductor News, Analysis and Features | Tom's Hardware
… Premium Premium TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors. …
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Samsung reportedly set to distribute up to $26.6 billion to staff in AI-driven semiconductor bonuses after last-minute union deal — average payouts could approach $400,000 per chip employee
… Demand for High Bandwidth Memory HBM and other AI-oriented components has triggered what analysts are calling a semiconductor supercycle. …
ASML CEO says Elon Musk is 'very serious' about TeraFab chipmaking megaproject, confirms direct talks — Musk targets $119 billion Texas semiconductor facility
… Go deeper with TH Premium: AI and data centers Photonics and high-speed data movement is the next big AI bottleneck The data center cooling state of play Massive AI data center buildouts are squeezing energy supplies Ultra Ethernet: The data center interconnection of tomorrow TeraFab, which Musk an… …
Samsung's $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt
Samsung's tentative profit-sharing deal with its largest labor union averted an 18-day strike just days ago, but the agreement has triggered internal conflict that’s now threatening the company's ability to ship AI memory on schedule, according to a Seoul Economic Daily report published yesterday. …
Samsung chip workers vote to accept $340,000 average bonus, ending months-long strike threat — resentment over deal has slowed down Samsung foundry division
… TSP handles the back-end packaging and testing essential to producing high-bandwidth memory, and disruptions there could complicate Samsung's HBM4 production ramp for Nvidia's next-gen Rubin AI accelerators. …
Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration
… Go deeper with TH Premium: Memory AI data centers are swallowing the world's memory and storage supply The future of DRAM: From DDR5 to future ICs High-bandwidth memory roadmap Here's why HBM is coming for your PC's RAM EMIB connects multiple semiconductor dies using small silicon bridges embedded … …
Tech Industry News, Analysis and Features | Tom's Hardware
Tech Industry Latest about Tech Industry Samsung granted court injunction against imminent strike action in last-minute reprieve By Stephen Warwick Published 18 May 26 Tech Industry Samsung meeting transcripts show memory workers offered incredible 607% bonus worth $477,000, while logic chip staff … …
Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines
… High-NA EUV: not yet standard, already essential High-NA EUV is the semiconductor industry’s next major lithography transition, developed primarily for future sub-2nm processors, advanced AI accelerators, and dense memory technologies. …
News | Tom's Hardware
News Semiconductors power everything from PCs and data centers to cars, refrigerators, and more. And from semiconductors , CPUs and GPUs to AI , and more, through deeper dives and more insight than anyone else, Tom's Hardware is your expert guide to the world of tech. …