Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration
… TSMC's CoWoS lines, meanwhile, have been massively oversubscribed for more than two years. Nvidia alone is expected to account for roughly 60% of global CoWoS demand this year, with Broadcom and AMD absorbing another 26%. …