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SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

…The design is also architecturally compatible with existing System-in-Package configurations, meaning customers can integrate the new thermal capability without major redesigns. Follow Tom's Hardware on Google News , or add…

May 26, 2026 · Etiido Uko