South Korea is investing $520 billion in Samsung and SK Hynix to build more HBM fabs for AI
… They will focus on producing lucrative HBM for the AI and data center markets rather than memory for the consumer technology market. …
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Intel Crescent Island PCB leak gives us our first look at the Xe3P GPU and its 160GB LPDDR5X memory design
… NVIDIA and AMD are already shipping data center AI hardware with high-end HBM memory like HBM3E , and neither is shy about teasing HBM4 for upcoming chips like Rubin and MI400. But HBM is getting harder to come by thanks to surging demand, and prices are climbing. …
Intel confirms its next-gen 'Crescent Island' data center GPU will support up to 480GB LPDDR5X memory
… Pricing has not been announced, though the LPDDR5X approach strongly signals a cost-optimized positioning relative to HBM-based rivals. …
Sound the alarm, DRAM shortage and memory crisis could last until 2030
… In addition to this, SK Group chairman Chey Tae-won reportedly said that even though SK Hynix is one of the dominant players in the HBM high-bandwidth memory market for data center and AI-focused GPUs, he and SK Hynix are keenly aware that purely focusing on the lucrative HBM market will adversely … …
SK Hynix plans to double wafer production capacity by 2030 as chairman warns AI will keep memory tight
… The company held a 58% share of the global HBM market in the first quarter of 2026, with Samsung and Micron each at 21%. Chey expressed hope that SK Hynix would become the primary HBM supplier for NVIDIA's next-generation Vera Rubin system. …
Samsung, SK Hynix, and Micron are being sued for alleged DRAM price fixing and collusion
… Instead, Micron can shutter its profitable, massive consumer- and OEM-facing Crucial brand as everyone pivots to HBM and everything AI. …
AMD warns DDR5 prices won't recover until 2028 as AI demand continues pulling supply away from consumers
… In the interview, David pointed to the AI boom that has shifted supply away from consumer DDR5 and toward HBM for AI data centers. …
NVIDIA's Rubin Ultra reportedly sticking to a dual-die design instead of a four-die plan
… Read more : Future of next-gen HBM: HBM4, HBM5, HBM6, HBM7, and HBM8 teased with 15,000W AI GPUs by 2038 Read more : NVIDIA ordering more CoWoS-L advanced packaging from TSMC: ready for more Blackwell AI GPUs Read more : NVIDIA's next-gen 'market-grabbing weapon': GB300 AI GPUs to be unveiled at GT… …
KIOXIA announces a brand-new type of SSD, and it's a game-changer for AI
… What makes it new is that it allows the GPU to access the SSD's high-speed flash memory as an extension of existing High Bandwidth Memory HBM in AI systems. …
Micron's CEO says AI memory demand is just in its 'first innings' and memory supply is already insufficient
… Read more : Samsung readying mass production of next-gen HBM4 memory in 2026, 24Gb GDDR7 dies, 128GB+ DDR5 Read more : Micron begins shipping industry's fastest HBM4 at 11Gbps, to partner with TSMC for future HBM4E Read more : AMD teases next-gen Helios rack-scale platform: new EPYC + Instinct chip… …