TweakTown News Processors TL;DR: Samsung aims to develop 1nm semiconductor technology by 2030 using innovative fork sheet technology to enhance transistor density, competing directly with TSMC. …
TweakTown News Gaming TL;DR: Apple's A20 chip for the base iPhone 18 will continue using TSMC's InFO packaging instead of the advanced WMCM technology due to ongoing DRAM shortages. …
TweakTown News Artificial Intelligence TL;DR: Tesla's TeraFab project, a $25 billion chip factory in Austin, brings Intel on board to help produce chips at volumes that rival TSMC's, using advanced 2nm process technology and packaging. …
… Read more : NVIDIA says TSMC's new fabs will be the 'foundational pillar' of tech supply chain in the USA Read more : TSMC's next-gen 2nm monthly production capacity to hit 80,000 wafers by the end of 2025 Read more : TSMC's first fab in Kumamoto, Japan secures initial orders from Sony and Denso It… …
… DoB is a wafer-level packaging technology that mounts semiconductor dies directly onto a base PCB. …
AMD Zen 4 Hub AMD's Ryzen 7000 series of CPUs built on its Zen 4 technology using TSMC 5nm and 6nm nodes launched at the end of September 2022. …
… If Intel or Samsung were to handle the A21 and TSMC handles the Pro silicon, then Intel's 18A-P and Samsung's SF2 offerings may be evaluated by Apple as potentially comparable to TSMC's leading-edge nodes. …
… However, those ambitions may have pushed TSMC's advanced packaging technology past its practical limits. …
… A lifelong gamer since the 8-bit Nintendo era, it was the CD-ROM-powered 90s that cemented his love for all things games and technology. …
… Jak's love for science, space, and technology, and, more specifically, PC gaming, began at 10 years old. It was the day his dad showed him how to play Age of Empires on an old Compaq PC. Ever since that day, Jak fell in love with games and the progression of the technology industry in all its forms. …