…high HBM demand through 2026 and 2027, the reasons behind the demand will differ during the year. It believes that in 2026, HBM demand will be driven by custom AI chips, while…
…Mainstream firms responsible for DRAM production, such as Samsung, SK hynix, and Micron, have shifted their focus towards HBM by converting existing production lines and scaling up process technology, which is currently…
…In a related coverage, we discussed that the biggest bottleneck for Huawei in scaling up AI chip production is actually HBM, rather than semiconductors, given that the chip giant has relied on…
…other as HBM does. Today, NEO Semiconductor has demonstrated the 3D X-DRAM Proof-of-Concept and also secured investments to further advance the project. With the POC test chips, the company…
…That has led to a big need for LPDDR5 and LPDDR5X memory, especially SOCAMM2 . With HBF's multi-layered stacking approach, chip makers and AI ecosystem providers can not just reduce PCB…
HBM memory will see a big upgrade with next-gen HBM5 and HBM6 standards , which are already being developed with new TC Bonders. Semiconductor Firm, Hanmi, Showcases First Wide TC Bonders Designed…
…on its chipsets’ NPU and NVMe storage to perform the heavy lifting. That’s why, according to Prosser, the iPhone 20 will switch to mobile High-Bandwidth Memory (HBM) next year. Apple…
…a massive chip fabrication plant in Onyang, Korea. This facility will span the size of four soccer fields and will be used for producing next-generation DRAM products, including HBM. The facility…
…Related Story Micron Warns Memory Crunch Will Outlast 2026 as AI Demand Outpaces What HBM, DRAM and NAND Can Supply Currently, the situation has prompted China's AI chipmakers to double down…
…Current chip requirements involve integration of HBM and logic chips in a single package & the number of HBM chips is expanding aggressively. Recently, OpenAI showcased how it aims to use an EMIB…
