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SK hynix has revealed its next-generation technology roadmap, listing HBM5, GDDR7-next, DDR6 & 400+Layer 4D NAND beyond 2029. SK hynix Reveals Its Next-Gen DRAM/NAND Roadmap: HBM5, GDDR7-Next…
SK hynix has responded to rumors that the company is exiting the consumer business, stating that the Korean giant has no such plans for now. SK hynix Will Still Satisfy Consumer Demand…
SK hynix, the Korean memory giant, now plans to establish a U.S. "AI solutions" firm, interestingly called "The AI Company", intending to take DC opportunities to new heights. SK Hynix's…
As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After…
SK hynix, the renowned memory manufacturer, plans to take advanced packaging into its own hands, as the firm is reportedly looking to set up a 2.5D packaging facility in the US…
Korean memory manufacturer SK hynix has announced a yield improvement for its hybrid bonding packaging technology for high bandwidth memory (HBM) modules. Hybrid bonding enables memory chip manufacturers to bond memory layers…
SK hynix has announced the successful development of its LPDDR6 memory utilizing the 1c process node, offering up to 10.7 Gbps speeds. SK hynix LPDDR6 Memory Delivers 33% Faster Speeds While…
The HBM race has seen major acceleration across DRAM makers, and SK Hynix is showcasing its new HBM4E solution, which increases density & bandwidth. HBM4E Drives A 33% Die Density Uplift, and a…
One of the largest DRAM manufacturers, SK hynix, plans to increase production by a significant level to cater to the shortages; however, it appears that demand is currently 'too high'. SK Hynix…
SK hynix has announced the completion of development of the HBM4 memory, which is now in full production. SK hynix's 10 Gbps HBM4 Memory Completes Development Phase & Is Now In Full…