AMD's EPYC Venice To Outpace NVIDIA's Vera CPUs With 6.75M Units by 2027, Morgan Stanley Says, as Zen 6 Eclipses a 5.75M Rival
…NVIDIA is utilizing TSMC's CoWoS packaging solution for two key products, CoWoS-L for AI GPUs such as Blackwell and Rubin, and CoWoS-R for Vera CPUs. The CoWoS-L capacity…