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…We recently reported that the I ntel Nova Lake tile die size will be nearly 110 mm2 using TSMC's N2 process node, while variants with bLLC will measure around 150+ mm2…
…Xe-LPG (Meteor Lake) Process Node TBA TBA TSMC 2nm? TSMC 3nm / Intel 3 TSMC 5nm (3nm Lunar Lake Tile) TSMC 6nm TSMC 6nm Max Xe Cores TBA TBA TBA 12 32…
…This huge demand has prompted TSMC to boost its 3nm production by 50% to prepare well for Rubin GPUs. TSMC's President, C.C. Wei, has stated that NVIDIA wants more wafers…
…Related Story TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi During the Tech Tour 2025, Intel confirmed that it will officially launch…
…Lovelace AD106-350 Ada Lovelace AD107-400 Process Node TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N Die Size 608mm2 608mm2 378.6mm2 294.5mm2 294…
…Lovelace AD106-350 Ada Lovelace AD107-400 Process Node TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N Die Size 608mm2 608mm2 378.6mm2 294.5mm2 294…
…Graphics Card Variant Arc B7XX Arc B580 Arc A770 GPU Die Arc BMG-G31 Arc BMG-G21 Arc ACM-G10 Process Node TSMC 5nm TSMC 5nm TSMC 6nm Die Size TBD 272mm2…
…Process Node TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N TSMC 4N Die Size 608mm2 378.6mm2 294.5mm2 294.5mm2 190.1mm2 TSMC 4N TSMC 4N Transistors…
Apple’s A18 Pro from 2024 utilizes TSMC’s InFO-POP (Integrated Fan-Out Package on Package) technology, meaning that the DRAM sits on top of the die as part of the…
…Related Story TSMC’s AI Windfall Is Pushing Apple Out, And Cupertino Is Turning To Intel’s 18A-P Before It Loses Bargaining Power The A18 Pro chipset Apple probably wanted to…