Search: HBM and chips

OpenAI Patent Reveals Custom AI Chip With 20 HBM Stacks, Using Intel EMIB-Style Bridges to Smash Current Limits

… Can we see a future where Intel's EMIB technology gets used by OpenAI for the creation of its custom AI chips with many chiplets and large amounts of HBM memory? …

Apr 22, 2026 · Hassan Mujtaba

China's YMTC Is Now Tapping Into the DRAM Business, Producing It Domestically to Combat the HBM Shortage in the Region

… Related Story Another Chinese DRAM Maker Breaks Into DDR5 Memory, Mass Producing 64GB RDIMMs as Samsung and SK Hynix Run Dry The move by the state-backed chipmaker underscores China's growing urgency to boost its capability to manufacture advanced chips after the U.S. expanded export controls in De… …

Sep 25, 2025 · Muhammad Zuhair

SK hynix Verifies 12-Die Hybrid Bonded HBM Stack, but Won't Disclose Yield Figures as Next-Gen HBM4 AI Memory Race Heats Up

… While HBM memory chips are typically considered in the context of enterprise computing and workloads, hybrid bonding can create advantages for consumers as well through performance improvement. …

Apr 28, 2026 · Ramish Zafar

China's Premiere Memory Maker Hits HBM3 Roadblock As Domestic DRAM Makers Rush HBM Manufacturing

… Global DRAM vendors are already rushing into mass production for HBM4 memory, and are ramping up HBM3E solutions for next-gen AI Datacenters. HBM4 will play a key role in upcoming datacenter chips such as NVIDIA's Vera Rubin and AMD's MI400, both expected to land later this year. …

Apr 21, 2026 · Hassan Mujtaba

AI Sparks a 'DRAM Supercycle' After Years of Stagnation, Driven by Massive HBM Adoption as Big Tech Rushes to Build Custom ASICs

… The DRAM industry would be interesting to watch moving forward, especially since technologies like HBM4 would further scale up the production required. Big Tech craves HBM right now, and the only way to move forward is by increasing the supply. …

Oct 2, 2025 · Muhammad Zuhair

3D X-DRAM Hits Proof-of-Concept, HBM-Replacement with 10x Density vs Traditional DRAM & High-Yield Memory Design

… With the POC test chips, the company has demonstrated that 3D X-DRAM can be manufactured using existing 3D NAND infrastructure, adding multiple layers of DRAM instead of a stack like HBM memory. …

Apr 26, 2026 · Hassan Mujtaba

NVIDIA Not Interested In HBF Memory Despite 4TB Stacks Dwarfing HBM, Google Reportedly Locked As Sampling Begins This Year

… While HBM offers 32-64 GB capacities per stack right now, HBF will scale up to 4 TB capacities . As for speeds, HBM is faster, but with architectural optimizations, HBF will be able to provide enough throughput for critical AI tasks. …

Apr 28, 2026 · Hassan Mujtaba

China’s Largest Memory Manufacturer, CXMT, Plans to Allocate a “Large Chunk” of Its DRAM Production to HBM3, Hoping to Compete in the AI Race

… However, given that when you factor in the state of the Chinese HBM industry, CXMT's HBM3 technology would be a significant breakthrough, one that could allow Huawei to scale up production of its Ascend chips. …

Feb 10, 2026 · Muhammad Zuhair

Work on Next-Gen HBM5 & HBM6 Memory Is Already Underway, New Wide TC Bonders Ready

… Main features of the HBM6 memory standard include: Data Rate: 16 Gbps Number of I/Os: 4096 Total Bandwidth: 8.0 TB/s Number of die stacks: 16/20-Hi Capacity per die: 48 Gb Capacity per HBM: 96/120 GB Package Power per HBM: 120W Packaging Method: Bump-less Cu-Cu Direct Bonding Cooling Method: Immers… …

Feb 11, 2026 · Hassan Mujtaba

Samsung Postpones HBM5E Memory Production Indefinitely After D1d DRAM Yields Fall Short of Internal Targets

… It is expected to be used by HBM5E , the 9th Gen HBM solution from the Korean semiconductor company. The 1c DRAM is currently being used across three generations of HBM products, including HBM4, HBM4E, and HBM5 . …