Intel Rumored to Power Google’s Next-Gen TPUs With Its EMIB Packaging, as the Technology Gains Massive Attention Across the AI Industry
… Of course, as TrendForce notes, TSMC's CoWoS supply isn't expected to be affected at all by Intel's push for external customers; however, it would lead to diversification within the advanced packaging supply chain, ultimately a more optimistic move for the industry in the long run. …