… His coverage focuses on the corporate strategies and technological roadmaps of industry giants like TSMC, NVIDIA, Samsung, and Intel. …
… Related Story MediaTek Says Its Next-Gen Program Will Only Use Intel’s EMIB-T For Packaging If we go by the original plans, CPO was originally slated for commercialization by 2033, but NVIDIA fast-forwarded the optics roadmap by 5 years, bringing it forward in 2028 with its next-gen Feynman GPUs. …
… AMD believes that UMA will help shape its next-gen architectures, products, and roadmap. …
… Ajinomoto, the MSG Maker, Controls the Production of ABF That Is Absolutely Crucial For Advanced Packaging The aggressiveness of the AI demand cycle has left almost every supply chain entity involved facing shortages, whether in semiconductors, advanced packaging, OSAT services, and more. …