Intel’s public statement about the mash-up with Musk is almost comically vague. The company said that its “ability to design, fabricate, and package ultrahigh-performance chips at scale” will help accelerate Terafab’s goal of producing 1 terawatt of computing power a year to support “future advances in AI and robotics.” Pat Moorhead, a longtime chip-industry analyst and founder of Moor Insights & Strategy, predicts that Musk will lean on Intel for its advanced packaging capabilities to start. He notes that Tesla “doesn’t need [chip] design engineering; they’re already very capable of that.” Mo
5 Burning Questions About Elon Musk’s Terafab Chip Partnership with Intel“Terafab represents a step change in how silicon logic, memory, and packaging will get built in the future,” Tan said in a social media post. “Intel is proud to be a partner and work closely with Elon on this highly strategic project.” Exactly how Tan and Musk plan to execute such an ambitious vent… …
… Meanwhile, the option for up to 128 GB of unified memory, which has been around since the M3 Max, makes it a strong option for running on-device AI models. …