Chipzilla gets Google packaging sniff – Fudzilla.com
News Jun 2, 2026 by Nick Farrell Chipzilla gets Google packaging sniff Intel’s EMIB-T packaging appears to be getting more attention as TSMC’s AI packaging queue comes under serious…
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Intel’s public statement about the mash-up with Musk is almost comically vague. The company said that its “ability to design, fabricate, and package ultrahigh-performance chips at scale” will help accelerate Terafab’s goal of producing 1 terawatt of computing power a year to support “future advances in AI and robotics.” Pat Moorhead, a longtime chip-industry analyst and founder of Moor Insights & Strategy, predicts that Musk will lean on Intel for its advanced packaging capabilities to start. He notes that Tesla “doesn’t need [chip] design engineering; they’re already very capable of that.” Mo
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