Intel and SoftBank, through their subsidiary Saimemory, have been developing an alternative technology to the popular high-bandwidth memory (HBM) to provide more bandwidth and capacity for memory modules used with powerful…
China's domestic memory manufacturers are rushing to produce HBM chips, but the biggest DRAM maker has run into roadblocks with HBM3 tech. CXMT Is Reportedly Struggling With Its HBM3 Development & Has…
…This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions. The company's mass-production capabilities also…
…VCS), the manufacturer can ensure that HBM chips thrive in mobile devices despite the size constraints by stacking DRAM dies in a “staircase” configuration and filling the gaps with copper pillars. The…
…However, Samsung and SK hynix are several generations ahead of CXMT. The latest NVIDIA chips use HBM3e memory, and by the end of this year, AI GPU manufacturers are expected to enter…
…high HBM demand through 2026 and 2027, the reasons behind the demand will differ during the year. It believes that in 2026, HBM demand will be driven by custom AI chips, while…
…After the ruling, Samsung HBM still made it into China. We previously detailed how companies like CoAsia Electronics and Faraday supplied non-functional chips with HBM into China, though we believe due…
…The most popular memory today is on-chip HBM which strikes the balance between capacity and bandwidth. HBM combines vertically stacked DRAM chips with ultra-wide data paths and has the optimal…
…TSMC’s 2.5D packaging technology that places a chip on a wafer and then connects it to a substrate. By arranging logic chips and HBM side by side on a single…
…Over this period, its server GPUs have demanded not just more and more gigabytes of DRAM but an increasing number of DRAM chips. The recently released B300 uses eight HBM chips, each…
