Meet the Intel Pioneer Behind EMIB Chip Packaging
…began asking whether packaging had its own version of a scaling roadmap. One key limitation we identified was interconnect density—how many signals you can efficiently route in and out of a…
Search
All sources
tweaktown.com
6
semiwiki.com
5
wccftech.com
4
storagereview.com
4
github.blog
3
tomshardware.com
3
newsletter.semianalysis.com
3
spectrum.ieee.org
2
theregister.com
2
newsroom.intel.com
2
techpowerup.com
2
techcrunch.com
2
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
…But the industry can’t wait, and both these smaller players and hyperscalers alike with multimillion-unit roadmaps need to qualify a second packaging solution rather than wait for capacity that TSMC…
Qualcomm Unveils Data Center Roadmap with New Dragonfly Portfolio
…The Qualcomm Dragonfly AI300 joins the previously announced Qualcomm Dragonfly AI200 and AI250 in its data center solutions portfolio with an annual cadence AI accelerator roadmap. "Agentic AI is driving a significant…
Scaling the Memory Wall: The Rise and Roadmap of HBM
…been paramount and easily observed in accelerator roadmaps. There are 3 dimensions where capacity and bandwidth are scaling: Newer generations of HBM deliver higher bandwidth through faster signalling speeds, and denser core…
The Seasoning Company Behind Your Food Flavors Controls The Future Of AI Chips
…At the same time, as AI packages grow in size, ABF layer requirements increase, and techniques like semi-additive patterning (SAP) introduce the risk of compromising yield rates and ruining the entire…
448G: Ready or not, here it comes! - Semiwiki
…Operators in these environments are pressing for faster rates with minimal latency and power, making 448G the logical next step. Hyperscalers and large enterprise operators are preparing infrastructure roadmaps that anticipate both…
Nvidia embraces optical scale-up as copper reaches limits
…While CPO moves much of the optics and signal processing onto the package, lasers are usually kept separate for the purpose of serviceability. This helps to explain the $4 billion ($2 billion…
IMEC Thinks CFET Stacks Will Let Chips Keep Scaling Into the 2030s
…They function so that the same input signal will cause one to switch on and the other to switch off, which helps foster relatively efficient operation. Today they are built in pairs…
Flipper unveils a Linux-powered networking gadget built for hackers and tinkerers | TechCrunch
…Users can also run local AI models to operate the device, generate configs, and get useful tips without an internet connection. Flipper Devices has just announced the device and overall roadmap of…
Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026 - Semiwiki
At the 2026 VLSI Symposium, Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced…