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tomshardware.com › tech-industry › semiconductors

SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

performance during heavy computational workloads. The company believes that structurally preventing thermal throttling will enable next-generation memory layers (targeted for future generations like HBM5) to scale to higher stack heights and

May 26, 2026 · Etiido Uko