Apple is reportedly eyeing Intel and Samsung foundries for its A21 chips as TSMC supply constraints tighten
Apple is reportedly eyeing Intel and Samsung foundries for its A21 chips as TSMC supply constraints tighten
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Intel's Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 Rollout
…These supply constraints are pushing the industry to look into new advanced packaging solutions, and that's where Glass substrates come in. In the pictures, we can see two substrate prototypes, one…
Samsung Plans To Transform Your Smartphone & Tablet Into On-Device AI Powerhouses With High-Bandwidth Memory Chips Using Complex Packaging
…According to ETNews, Samsung intends to equip smartphones and tablets with HBM using ultra-high aspect ratio copper pillars with Fan-Out Wafer Level Packaging (FOWLP), the same packaging used on SoCs…
Intel's 18A-P Pulls in Apple's Next M Chips While EMIB Reportedly Wins Google TPUv8e As Customer Confidence Amps Up
…This has led major semiconductor companies such as TSMC to face severe supply constraints, all the while going on a large-scale expansion spree to meet demand . At the same time, Intel…
AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure
…advanced packaging growth through high-quality substrate technology, manufacturing excellence and resilient supply chain execution," said Jack Lu, President, Nan Ya PCB. "Kinsus is proud to support AMD's advanced packaging growth…
Intel Places Huge Order For Equipment Related To Advanced Packaging Production, Signaling Huge Interest in EMIB
…Recently, it has been reported in the supply chain that Intel has released a huge equipment purchase order to Taiwanese equipment manufacturers to simultaneously launch the expansion of EMIB advanced packaging plants…
Intel Gives Rundown on 14A/18A Chips & Advanced Packaging Opportunities, Revealing Customer Commitments Expected to Flow In by H2 2026
…s executives also discussed how the company is progressing with advanced packaging, given that it is a segment under severe constraints, with fewer foundries in the industry that could serve as viable…
AMD Invests $10 Billion In Taiwan as Helios AI Racks With Venice EPYC & MI450X Head Toward Multi-Gigawatt Deployments
…More than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging capabilities for AI infrastructure Industry-leading EFB-based 2.5D packaging to enable higher…
Intel Foundry's Rio Rancho Facility To Become Its Crown Jewel In Production of Next-Gen Glass Substrates
…These supply constraints are pushing the industry to look into new advanced packaging solutions, and that's where Glass substrates come in. Related Story Apple’s AR Glasses To Replace The Vision…
New iPhone MagSafe removal rumor makes no sense at all
…Wireless charging already requires glass or composite backs for power transfer, which sets the real constraint on materials rather than the magnet array. Apple integrates thin, passive magnets into a mature layout…