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TSMC

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TSMC's CEO Calls Intel a Formidable Competitor but Says No Shortcuts Exist in the Foundry Game

…Wei - TSMC Chairman & CEO Next, C.C. shares some thoughts on Intel's EMIB technology. When asked about how he views TSMC's own packaging technology versus EMIB, he said that TSMC…

Apr 16, 2026 · Hassan Mujtaba

TSMC Converts 28nm Capacity to 4nm as 1.4nm Plans Advance

…Industry estimates suggest the investment exceeds approximately $2.79 billion USD as TSMC continues prioritizing advanced-node output. The older equipment removed from Taiwanese facilities is reportedly being transferred to TSMC’s…

May 6, 2026 · Hilbert Hagedoorn

TSMC's 2nm Supply Crunch Is Forcing Smartphone Makers to Reserve Top Chipsets for 'Ultra' Models Only, as DRAM Shortage Piles On

…The advanced 2nm process has ‘insufficient yields,’ with TSMC facing a supply crunch that will force smartphone makers to reserve top-end SoCs for ‘Ultra’ models only Despite the fact that TSMC…

Apr 16, 2026 · Omar Sohail

Firmenchef Che-Chia Wei: TSMC arbeitet hart, um Kundennachfrage zu bedienen - Golem.de

Auf Google folgen (öffnet im neuen Fenster) Der Halbleiterhersteller TSMC ist darum bemüht, mit der großen Nachfrage nach Chips Schritt zu halten. Wie Reuters berichtet (öffnet im neuen Fenster) , erklärte der CEO…

Jun 4, 2026 · Mike Faust

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r/hardware · u/-protonsandneutrons- · 4w ago

TSMC: World’s largest chipmaker does not rule out price rises as costs increase

r/hardware · u/sr_local · Jun 4, 2026

TSMC CEO Says Company's Chip Supply Won’t Meet AI-Fueled Demand for Years

r/hardware · u/sr_local · May 25, 2026

TSMC employees threaten Samsung-style strikes over bonus cut rumors despite a 58% profit jump

r/hardware · u/chip_thoughts · May 10, 2026

[News] Behind TSMC’s High-NA EUV Deferral: Low-NA Stays Strong, Customer Landscape Shifts, and ASML Quietly Pivots

r/hardware · u/charliehu1226 · May 6, 2026

[News] TSMC Reportedly Upgrades Central Taiwan 28/22nm Fab to 4nm; Phase 2 1.4nm Trial Production May Start 3Q27

TSMC Accelerates CoPoS Packaging to Replace CoWoS, as Glass Core Substrates Cut Costs 30% and Boost Wafer Utilization Past 90%

…Meanwhile, TSMC also plans on leveraging Glass Substrate technology for CoWoS, which is currently in development and provides various enhancements such as lower costs, more die utilization, etc. TSMC is working with…

Jun 20, 2026 · Hassan Mujtaba

TSMC's US Expansion Plans Grow More Aggressive With Twelve Planned Arizona Fabs, as Sole Reliance on Taiwan Appears to Be a 'Dead End'

…Related Story TSMC’s AI Dominance Isn’t Under Threat By Intel Due To Key Raw Material Production, Says Citi The report states that TSMC will add two more wafer fabs and…

Apr 2, 2026 · Muhammad Zuhair

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TSMC

Videos

TSMC's CEO Calls Intel a Formidable Competitor but Says No Shortcuts Exist in the Foundry Game

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Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters - Semiwiki

Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031 - Semiwiki