… In the NAND segment, SK hynix is pursuing its ‘AI-NAND Family’ strategy, developing next-generation products specialized for each application area, including ‘AIN-P,’ a next-generation high-speed eSSD NAND, and ‘AIN-B,’ which leverages TSV technology to secure high bandwidth, laying the technologic… …
… SK hynix Reveals Its Next-Gen DRAM/NAND Roadmap: HBM5, GDDR7-Next, LPDDR6, & Gen7 SSDs In 2029-2031 Timeframe At the SK AI Summit 2025, SK hynix revealed its next-gen DRAM memory and NAND flash product roadmap while talking about several next-gen technologies, such as custom HBM, HBF, and AI-optimi… …
… 5 nm 2nd generation 3 nm expected in 2025, reduces power by 50%, improves perf by 30%, reduces area by 35% Samsung claims 60-70% yields as of May 2023 In Jul 2023 Samsung claimed 60% yields, and points out that this is better than TSMC According to a newer report, both Samsung and TSMC are struggli… …
PCIe Gen5 Storage Hits 14.9 GB/s with BiCS8 NAND The PCI Express 5.0 SSD market has evolved rapidly, though not always of us Guru's with the current Ai boom . …
… The HBM bottleneck is undoubtedly a key barrier that Chinese firms hope to address, especially since Huawei recently announced its in-house HBM process integration in its next-gen AI chips. …
Samsung just showcased its next-gen HBM4E memory along with its PCIe Gen6 SSDs & SOCAMM2 RAM for NVIDIA's current & future AI platforms. …
… Mainstream SSD suppliers like Samsung with V-NAND, Kioxia and Sandisk with BiCS, and Micron typically use multi-die stacking inside TSOP, BGA, or other packages before mounting them onto a base PCB. …
… The defining innovation of 3D NAND is the vertical stacking of memory cells — sometimes 200+ layers high in modern dies. This allowed manufacturers to scale capacity without pushing cell sizes to impractical extremes, which had begun causing reliability issues in late-generation planar NAND. …
… Read more : Samsung readying mass production of next-gen HBM4 memory in 2026, 24Gb GDDR7 dies, 128GB+ DDR5 Read more : Micron begins shipping industry's fastest HBM4 at 11Gbps, to partner with TSMC for future HBM4E Read more : AMD teases next-gen Helios rack-scale platform: new EPYC + Instinct chip… …
… Continue reading: Intel CEO confirms ongoing collaboration with NVIDIA on new products full post Sony taps TSMC as a manufacturing partner for next-gen image sensors in a new Japan-based joint venture Hassam Nasir | May 10, 2026 7:39 PM CDT Sony is teaming up with chip manufacturing giant TSMC to f… …